Embedded computing systems are essential building blocks for key digital technologies. The pace of innovation and adoption of these systems is rapid. As a result, it is increasingly important to design for the sustainable operation and lifecycle of these systems and their applications. For example, the power consumption of x86 processors has been reduced by 62% in 5 years, while maintaining performance. In 24/7 operations, energy and cost savings can be achieved by retrofitting existing systems. However, replacing the entire system, as often required in holistic designs, is not very sustainable. Computer-on-Modules offer a much more sustainable design approach. To upgrade an application, only the compact module needs to be replaced. All other components such as the carrier board, power supply, chassis, and peripherals can be retained. This not only avoids huge amounts of e-waste, but also reduces the financial investment. For example, embedded edge servers can be upgraded at half the cost.
None of this is new. Computer-on-Modules have been standardized since 1999. Today, the SMARC Module and COM Express standards are well established, but they no longer cover all the technological advantages of today’s and tomorrow’s processor silicon. COM-HPC is the new PICMG standard to meet the growing demand for the highest performance. It’s not only the computing power, but also the extremely high data throughput that is important to process the increasing amount of data.
In addition, modular design can extend the life and service life of applications, making them more sustainable. Modular systems are easier to repair and can be upgraded with new capabilities such as artificial intelligence. Modularity also enables sustainable recurring revenue business models based on as-a-service offerings. Customers can continuously upgrade to the latest features on the same hardware, a key enabler of sustainable business models.
Author
Christian Eder, Director Market Intelligence at congatec
Auwiesenstr. 5, 94469 Deggendorf, Germany
christian.eder@congatec.com
